- Research areas
- At the Research and Technology Center, we provide fundamental technologies that are the core of new products and which also support monozukuri manufacturing.
Transmission technology for next-generation in-vehicle and connected car communications
Signal relay transmission experiment by means of antenna design/analysis, radio wave irradiation to vehicles and radio over fiber transmission
We engage in research and development of elemental technology for the faster, highly reliable in-vehicle communications and for higher frequency in-vehicle outside-vehicle communications that are expected to be required for mobility in the future.
- Optical communications system
- Optical digital transmission / Radio over fiber
- Wireless communications system
- Communications control / Interference suppression / Radio-wave propagation and emulation / Antenna
- Wiring harnesses for the next generation
- Evaluation and analysis of high-frequency component characteristics
In-vehicle wireless communications and antenna evaluation system
High-frequency device measurement
Nano-technology and fundamental material technology for next-generation automotive, environmental, and energy technologies
Synthesis of nano-carbon film on the surface of the connecting component
We conduct research and development to establish elementary technology for various functional materials such as the conductive and insulating materials needed to create added value next-generation wiring harnesses and to utilize energy effectively.
- Surface treatment technology for materials
- Synthesis and compositing of nanomaterials / Coating
- Surface analysis technology for materials
- Conductive function development mechanism analysis / Simulation analysis / Visualization
- Creation of environmental materials
- Support for multimaterial / Thermal control materials
Visualization of the conductive part on the surface of the component
High strengthening of heat insulating materials by means of chemical modification
Material evaluation and analytical technology for material reliability to confirm maintenance of function
Silicone wafer’s high resolution electron microscope
We are strengthening our fundamental technologies so that we can evaluate and analyze materials necessary for the Yazaki Group’s operations, developing advanced analytical technologies for future use. A diverse range of analysis and evaluation equipment with measurement informatics allow us to respond to ever greater demand for more sophisticated solutions.
- Materials analysis
- Chemical composition & Structural analysis / Surface & Morphological analysis
- Polymer degradation analysis / Metallic material corrosion analysis
- Computational materials science
Cross-sectional and element mapped SEM image of corroded aluminum alloy
Molecular dynamics simulation of a polymer crystallization
EMC & related systems evaluation technology for electrical system reliability to prevent loss of function
Electric field evaluation for automobiles (Semi-anechoic chamber)
We will establish the EMC & related system evaluation/analysis technology that responds to the increasingly severe electromagnetic wave environment, such as the diversification of radio wave usage environments and the increase in high voltage and current due to the evolution of xEV.
- Electromagnetic environment evaluation/analysis/countermeasure technology for EMC & related systems in the future
- Electromagnetic field shield technology for EMC & related systems in the future
- Analysis/modeling technology for high reliability electromagnetic environmental evaluation
Electromagnetic field shield evaluation equipment (triaxial method)
Electric field distribution analysis at the periphery of an antenna
Welding technology for creation continuity of functions
Vibration analysis for behavioral verification of an ultrasonic welding tool
We develop welding technology using process analysis to accommodate components that change with the times, and requirements such as higher voltage and higher current due to the evolution of xEV.
- Research and development of dissimilar metal welding / other various welding technologies
- The image shows behavior analysis of dissimilar metal welding using ultrasonic welding
- Thermal imagery analysis
- Heat distribution and heat input in the welding process / visualization of heat dissipation transition
- Observation of the cross section of the welded part
- Cross-sectional observation of the welding interface
Observation of the temperature distribution at the time of welding using a thermography
Cross sectional observation near the interface of the joint (the image shows a Sn plated Cu plate plus a Sn plated copper coated steel wire)
Advanced technology to explore new areas
In order to develop the Yazaki Group's technology and business areas, we are verifying the feasibility of advanced technology, collecting the latest information, collaborating with universities and research institutes, and cooperating with other companies.